Title:
MOUNTING SUBSTRATE FOR SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP3801397
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To improve reliability for mounting BGA or flip-chip connecting structure.
SOLUTION: A plurality of metal electrodes 3 is provided on the lower side of a BGA package sealing a semiconductor therein, and a solder ball with a 500 μm diameter D is connected to each of the metal electrodes 3. A metal wiring 13 of 700 μm height H1 and 250 μm width W1 is formed protruded to the side of the BGA package 1 on a mounting surface 11a of a mounting substrate 11 in its position corresponding to each of the solder ball 5 in the BGA package 1. The solder balls in relation to metal wirings 9 are connected to each of the metal wiring 9. Even though stress is generated due to difference in coefficient of thermal expansion between the BGA package 1 and the mounting substrate 11 on mounting or after mounting, deformation of the metal wiring 13 can absorb the stress.
Inventors:
Yuichi Yata
Application Number:
JP31057899A
Publication Date:
July 26, 2006
Filing Date:
November 01, 1999
Export Citation:
Assignee:
株式会社リコー
International Classes:
H01L21/60; H05K3/34; H01L23/12; H05K1/18; (IPC1-7): H01L21/60; H01L23/12; H05K1/18; H05K3/34
Domestic Patent References:
| JP7183332A | ||||
| JP9260427A | ||||
| JP10209205A | ||||
| JP9223715A | ||||
| JP4093145U |
Attorney, Agent or Firm:
Shigeo Noguchi