To provide a highly reliable printed wiring board by which high- density wiring can be performed and enough strength in wire bonding property can be ensured.
This printed wiring board comprises a first circuit pattern 12 formed on one surface of an insulating substrate 11, an insulating layer 13 that is applied to and formed on the insulating substrate 11 on the side where the first circuit pattern 12 is formed, and where a connecting bottomed hole 14 is bored from the front side so as to expose the first circuit pattern 12, and a second circuit pattern 15 that is formed on the surface of the insulating layer and the bottomed hole bored on this insulating layer, and where the first and the second circuit patterns are electrically connected via the bottomed hole. A member 16 to be bonded is provided on an upper part of the bottomed hole and on the second circuit pattern near the bottomed hole, and a protruding portion 17 consisting of the same material as that of the member which is to be bonded and applied in the bottomed hole whereupon the member 16 is provided.
KAMIYAMA KOICHI
SUGA SHINJI
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