Title:
電子部品搭載多層配線基板及びその製造方法
Document Type and Number:
Japanese Patent JP5539453
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To incorporate an electronic component and reduce the thickness of a substrate in an electronic component mounting multilayer wiring board in which the electronic component is electrically connected with a wiring board body through wire bonding.SOLUTION: An electronic component mounting multilayer wiring board includes: an electronic component (34); a core material layer (10) having first openings (16, 26) housing the electronic component; a resin layer (18) laminated on one surface of the core material layer and having a second opening (20) larger than the first openings; a support layer (30) laminated on the other surface of the core material layer and supporting the electronic component; multiple connection conductor parts (14b) disposed on the one surface of the core material layer which is located around the first openings and on the inner side of the second opening; a bonding wire (38) electrically connecting the electronic component with the connection conductors; and a sealing resin (40) filling the first and second openings for sealing the electronic component and the bonding wire.
Inventors:
Machida Hirohiro
Application Number:
JP2012158823A
Publication Date:
July 02, 2014
Filing Date:
July 17, 2012
Export Citation:
Assignee:
Shinko Electric Industry Co., Ltd.
International Classes:
H01L23/12; H01L25/065; H01L25/07; H01L25/18; H05K3/46
Domestic Patent References:
| JP2008103615A | ||||
| JP2002217327A | ||||
| JP2003282771A | ||||
| JP200115926A | ||||
| JP11126978A |
Attorney, Agent or Firm:
Atsushi Aoki
Tetsuro Shimada
Higuchi Souji
Tetsuro Shimada
Higuchi Souji