Title:
多層配線基板
Document Type and Number:
Japanese Patent JP4429760
Kind Code:
B2
Abstract:
In a wiring layer of a first layer of a multilayer wiring board, respective wiring patterns are drawn out from pads in an outermost portion of a pad placement region, from pads located on diagonal lines in the vicinities of the corners of the relevant region, and from pads located in diagonal directions between adjacent rows in an internal portion of the relevant region. Further, in each of wiring layers of second and subsequent layers, among pads electrically connected through via holes to the pads from which wiring patterns are not drawn out in a wiring layer of an upper layer, respective wiring patterns are drawn out from pads in an outermost portion of a pad placement region; and from pads located in diagonal directions between adjacent rows in an internal portion of the relevant region.
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Inventors:
Eiichi Hirakawa
Application Number:
JP2004044306A
Publication Date:
March 10, 2010
Filing Date:
February 20, 2004
Export Citation:
Assignee:
Shinko Electric Industry Co., Ltd.
International Classes:
H01L23/12; H05K3/46; H01L21/60; H01L23/498; H05K1/11
Domestic Patent References:
| JP10335532A | ||||
| JP11260955A | ||||
| JP11297885A | ||||
| JP2003318310A |
Attorney, Agent or Firm:
Keizo Okamoto