Title:
MULTI-LAYERED PRINTED BOARD AND SHEET ADHESIVE
Document Type and Number:
Japanese Patent JP2002141664
Kind Code:
A
Abstract:
To provide a method for preventing an adhesive from flowing out to an adhesive flowing-out prevented area such as a hole and a cavity when a multi-layered printed board is laminated and adhered with a sheet adhesive.
When the sheet adhesive 1 is processed, a hardened layer 8 is formed on an opening to form a wall in advance, thereby preventing a resin component from flowing out when the printed board is laminated and adhered. Further, an adhesive flowing-out preventive wall 9 is formed around the adhesive flowing-out preventive area as a method for preventing the resin component from flowing out with high reliability additionally to the mentioned method.
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Inventors:
WATANABE KEIKO
MATSUDA YOSHIO
YAGYU HIDEMI
MATSUDA YOSHIO
YAGYU HIDEMI
Application Number:
JP2000336007A
Publication Date:
May 17, 2002
Filing Date:
November 02, 2000
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H05K3/00; H05K3/46; (IPC1-7): H05K3/46; H05K3/00
Attorney, Agent or Firm:
Kaneo Miyata (1 person outside)
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