To provide a multi-piece substrate for mounting electronic components in which a probe pin hardly contacts a wiring conductor different from a wiring conductor that is an object for electric inspection when performing electric inspection.

The multi-piece substrate for mounting electronic components is so configured that a second wiring conductor 4 is routed inside or on a lower surface of an insulation substrate area 5 and electrically connected to a wiring conductor of an adjacent insulation substrate area 5 inside of an outside end 3a of a first wiring conductor 3 in the insulation substrate area 5.