Title:
MULTI-POT SEALED MOLD
Document Type and Number:
Japanese Patent JPH06143325
Kind Code:
A
Abstract:
PURPOSE: To eliminate a charging irregularity even if resin tablets have irregular weights.
CONSTITUTION: A multi-pot sealed mold is cast with resin in a product cavity 4 communicating with culls l by pressing resin tablets in the culls 1 in such a manner that the culls 1 communicate with each other via a runner 3. A dummy cavity 6 is provided in the runner 3 to decrease flowing speed of the resin to be fed to adjacent cull 11 via the runner 3.
Inventors:
ONO EIJI
Application Number:
JP29677092A
Publication Date:
May 24, 1994
Filing Date:
November 06, 1992
Export Citation:
Assignee:
HITACHI LTD
HITACHI TOKYO ELECTRONICS
HITACHI TOKYO ELECTRONICS
International Classes:
B29C45/02; B29C45/26; B29C45/27; H01L21/56; (IPC1-7): B29C45/02; B29C45/26; H01L21/56
Attorney, Agent or Firm:
Yamato Tsutsui