Title:
MULTI-STAGE SUBSTRATE PROCESSING SYSTEM
Document Type and Number:
Japanese Patent JP2022002301
Kind Code:
A
Abstract:
To provide a vacuum process module which has a pre-shaped ceiling and/or bottom that is shaped to bulge outwards, where the shape of the ceiling and/or the process module counteracts deformation caused by vacuum pressures and/or high temperatures when processing substrates in the process module.SOLUTION: The process module may have a side openable to a transfer chamber and an opposite side opposite the openable side. The bulge may be asymmetric, with the peak of the bulge off-center on the ceiling and closer to the opposite side than to the openable side. A rigid structure may be mounted on the ceiling to adjust the magnitude of the bulge in the ceiling. The beam may be, e.g., a rigid beam having an adjustable lift mechanism for lifting up an attached part of the ceiling. The process module may accommodate a plurality of substrates for processing, with each substrate occupying a dedicated stage in the process module.SELECTED DRAWING: Figure 5
Inventors:
MORI YUKIHIRO
Application Number:
JP2021099371A
Publication Date:
January 06, 2022
Filing Date:
June 15, 2021
Export Citation:
Assignee:
ASM IP HOLDING BV
International Classes:
H01L21/677
Attorney, Agent or Firm:
Yasuhiko Murayama
Shinya Mitsuhiro
Tatsuhiko Abe
Shinya Mitsuhiro
Tatsuhiko Abe
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