Title:
MULTICHIP MODULE
Document Type and Number:
Japanese Patent JPH06177321
Kind Code:
A
Abstract:
PURPOSE: To reduce cost and improve performance, by reducing the mounting board area of a multichip module.
CONSTITUTION: When a chip like a high speed memory chip 104 is mounted on a package board 101, the chip is not mounted on a mounting circuit board 102, and an I/O pad of the chip is connected with an I/O pad of the mounting circuit board 102.
Inventors:
OTA TOSHIYUKI
Application Number:
JP32322692A
Publication Date:
June 24, 1994
Filing Date:
December 02, 1992
Export Citation:
Assignee:
NEC CORP
International Classes:
H01L23/538; H01L25/04; H01L25/18; (IPC1-7): H01L25/04; H01L25/18; H01L23/538
Domestic Patent References:
| JPS60207358A | 1985-10-18 |
Attorney, Agent or Firm:
Yosuke Goto (2 outside)
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