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Title:
MULTILAYER CERAMIC CIRCUIT SUBSTRATE AND MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2013191899
Kind Code:
A
Abstract:

To provide a method of manufacturing a multilayer ceramic circuit substrate.

A method for manufacturing a multilayer ceramic circuit substrate comprises the steps of: preparing a plurality of ceramic green sheets; forming a groove having a desired line shape and a via hole connected to the groove in at least one ceramic green sheet of the plurality of ceramic green sheets; forming a conductive via by filling the via hole with conductive material; forming a circuit line connected to the conductive via by filling the groove with the conductive material; stacking the plurality of ceramic green sheets, and forming a ceramic green sheet stack; and sintering the ceramic green sheet stack.


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JPH0617029PROBLEM TO BE SOLVED: To manufacture a multilayer plate
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Inventors:
CHANG MYUNG WHUN
KIM JIN WAUN
LEE DAE HYEONG
HONG KI PYO
Application Number:
JP2013141241A
Publication Date:
September 26, 2013
Filing Date:
July 05, 2013
Export Citation:
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Assignee:
SAMSUNG ELECTRO MECH
International Classes:
H05K3/46; H05K3/10
Domestic Patent References:
JP2007250996A2007-09-27
JP2000299560A2000-10-24
JP2003124397A2003-04-25
JP2003100802A2003-04-04
JPS566497A1981-01-23
JPH0195588A1989-04-13
JP2005093945A2005-04-07
JPS63194A1988-01-05
Attorney, Agent or Firm:
Hidekazu Miyoshi
Masakazu Ito



 
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