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Patent Searching and Data


Title:
MULTILAYER CIRCUIT BOARD AND ELECTRONIC DEVICE
Document Type and Number:
Japanese Patent JP2007305642
Kind Code:
A
Abstract:

To provide a multilayer circuit board for reducing useless radiative noise and suppressing variations in voltage, by providing an auxiliary capacitor capable of reliably supplying charge also to a power terminal having a large change in current in addition to three-terminal capacitors for noise elimination, and to provide an electronic device.

The multilayer circuit board comprises: a ground layer 2 having a first signal layer 1 for packaging a microcomputer 5, and a pattern 20 for ground terminals; a power supply layer 3 having a pattern 31 for external power supplies and a pattern 32 for power terminals; and a second signal layer 4 having the three-terminal capacitor 6 and a two-terminal capacitor 7. The power terminal and ground terminal of the microcomputer 5 are connected to the patterns 32, 20 through lands 11a-17a, 11b-17b, respectively. The three-terminal capacitor 6 is packaged on lands 41, 42, 43 connected to the patterns 31, 32, 20, respectively, and the two-terminal capacitor 7 is packaged on lands 45, 46 connected to the patterns 32, 20, respectively.

COPYRIGHT: (C)2008,JPO&INPIT


Inventors:
TANAKA KAZUNARI
AZUMA TAKAHIRO
NAKAMURA ATSUSHI
HAYASHI TORU
Application Number:
JP2006129891A
Publication Date:
November 22, 2007
Filing Date:
May 09, 2006
Export Citation:
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Assignee:
MURATA MANUFACTURING CO
RENESAS TECH CORP
International Classes:
H01L23/12; H05K1/02; H05K3/46
Attorney, Agent or Firm:
Takakazu Tsukahara