Title:
MULTILAYER CIRCUIT BOARD
Document Type and Number:
Japanese Patent JP3902752
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a multilayer circuit board provided with an interlayer insulating material having good embedding property of a circuit pattern and good interlayer adhesive property and interlayer insulation property.
SOLUTION: In the multilayer circuit board, interlayer connection is performed by bringing one minute sharp projection 1b made in one conductive circuit layer 1a into contact with the other conductive circuit layer. Interlayer insulation is performed by a three layer structure film where a thermoplastic film 2a is inserted between a pair of thermosetting adhesion layers 2b.
Inventors:
Shiro Akama
Application Number:
JP2002288991A
Publication Date:
April 11, 2007
Filing Date:
October 01, 2002
Export Citation:
Assignee:
Nippon Mektron Co., Ltd.
International Classes:
B32B15/08; H05K1/11; H05K1/03; H05K3/46; H05K3/38; (IPC1-7): H05K3/46; B32B15/08; H05K1/03; H05K1/11
Domestic Patent References:
| JP846312A |
Attorney, Agent or Firm:
Kenji Yoshitake
Masami Tamama
Hidetoshi Tachibana
Yasukazu Sato
Hiroshi Yoshimoto
Yasushi Kawasaki
Masami Tamama
Hidetoshi Tachibana
Yasukazu Sato
Hiroshi Yoshimoto
Yasushi Kawasaki