To closely arrange respective layer conductive materials in an insulated condition, thereby thinly form a whole structure, by arranging plural conductive materials into a multilayer state, also an insulating film between the respective layer conductive materials.

In this structure, wherein conductive materials are arranged into two layers, a conductive material 20A, coating insulating films 10a and 10b, is arranged in an upper layer, and a conductive material 20B, also coating the insulating films 10a and 10b is overlapped on the conductive material 20A in an orthogonal direction to the upper layer, to be fixed to a lower layer by a resin 50. The respective end parts of the conductive materials 20A and 20B are folded to form a connecting end part 22A, and thereto an electric circuit element is connected. Since the conductive materials 20A and 20B on the upper and lower layers respectively are insulated by the insulating films 10b and 10a arranged between the conductive materials 20A and 20B respectively.