Title:
MULTILAYER ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2022094282
Kind Code:
A
Abstract:
To provide a multilayer electronic component which reduces an imbalance in current density between internal electrodes disposed at different distances from a mounting board.SOLUTION: A multilayer electronic component according to an embodiment of the present invention includes: a body including a dielectric layer and a plurality of internal electrodes laminated with the dielectric layer interposed therebetween; and an external electrode disposed on the body and connected to the plurality of internal electrodes. The plurality of internal electrodes include two or more internal electrodes having different thicknesses. The thickest internal electrode and the thinnest internal electrode among the plurality of internal electrodes are disposed on first and second outermost sides opposing each other in a lamination direction of the plurality of internal electrodes. Each internal electrode disposed between the thickest internal electrode and the thinnest internal electrode may have a thickness same as or greater than a thickness of an internal electrode that is adjacent in a direction of the second outermost side.SELECTED DRAWING: Figure 3
Inventors:
PYO HYE SUNG
JUN HO IN
JEON KI HUN
HONG DO HYUN
JUN HO IN
JEON KI HUN
HONG DO HYUN
Application Number:
JP2021095193A
Publication Date:
June 24, 2022
Filing Date:
June 07, 2021
Export Citation:
Assignee:
SAMSUNG ELECTRO MECH
International Classes:
H01G4/30
Attorney, Agent or Firm:
Longhua International Patent Service Corporation