Title:
積層型電子部品
Document Type and Number:
Japanese Patent JP7322336
Kind Code:
B2
Abstract:
A multilayer electronic component includes a body including dielectric layers and internal electrodes alternately disposed in a first direction, and external electrodes disposed on the body to be connected to the internal electrodes. At least one internal electrode of the internal electrodes includes a plurality of disconnected portions penetrating through a respective internal electrode. A disconnected portion of the plurality of disconnected portions includes at least one of a pore or a dielectric substance disposed to connect adjacent dielectric layers to each other. A dielectric filling ratio, defined as a ratio of an overall length of the dielectric substance to an overall length of the disconnected portion on a cross section in the third and first directions, is more than 20% to 80% or less.
Inventors:
Cha, Kyung Jin
Shin, Woochul
Lee, Seung Hae Eui
oh, bum seok
Shin, Woochul
Lee, Seung Hae Eui
oh, bum seok
Application Number:
JP2020020743A
Publication Date:
August 08, 2023
Filing Date:
February 10, 2020
Export Citation:
Assignee:
Samsung Electro-Mechanics Company Limited.
International Classes:
H01G4/30
Other References:
J. R. Yoon and D. S. Shin et al.,Control of Connectivity of Ni Electrode with Heating Rates During Sintering and Electrical Properties in BaTiO3 Based Multilayer Ceramic Capacitors,TRANSACTIONS ON ELECTRICAL AND ELECTRONIC MATERIALS,KR,The Korean Institute of Electrical and Electronic Material Engineers,2012年08月25日,Vol.13,No.4,pp.181-184
Attorney, Agent or Firm:
Patent Attorney Corporation RYUKA International Patent Office
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