Title:
MULTILAYER HIGH ATTENUATION SHIELDING STRUCTURE
Document Type and Number:
Japanese Patent JPS56130999
Kind Code:
A
Abstract:
A multi-layer radio frequency electromagnetic radiation shield structure, primarily for lamination to a housing of plastics material 10, comprises alternating layers of relatively high electrical conductivity metals, e.g. Al, Cu, B, D, F and low conductivity metals, e.g. stainless steel, Al-Cu alloy, A, C, E to combine the effects of reflection and absorption and thereby maximize the attenuation of the radiation Eo. Alternatively a similar structure of layers of materials with differing magnetic permeabilities may be used for the same purpose. High permeability films may consist of an alloy of Fe, Ni, Mo and Mn. Low permeability films may be made of Al.
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Inventors:
JIYATSUKU CHIYAARUSU FUORUKAAS
UIRIAMU RICHIYAADO KONREI
UIRIAMU RICHIYAADO KONREI
Application Number:
JP15150880A
Publication Date:
October 14, 1981
Filing Date:
October 30, 1980
Export Citation:
Assignee:
ILLINOIS TOOL WORKS
International Classes:
H01Q17/00; H05K9/00; (IPC1-7): H05K9/00