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Title:
MULTILAYER METAL-CLAD LAMINATE
Document Type and Number:
Japanese Patent JPH05327215
Kind Code:
A
Abstract:

PURPOSE: To prevent effectively occurrence of molding creases in the end parts and others of metal leaves of outermost layers by a method wherein the end part of glass cloth of a prepreg is subjected to a fray preventing treatment by using resin having a melting point of a laminate molding temperature or below.

CONSTITUTION: A prepreg 2 having glass cloth treated by resin for preventing a fray which has a melting point of a laminate postforming temperature or below is used. At the time of multilayer laminated molding, therefore, the resin for preventing the fray is melted again and thereby the thickness of the prepreg 2 is made uniform in this molding. Since a pressure is applied uniformly in the molding and a volatile constituent is removed smoothly, no crease occurs in a copper leaf 3 of the surface of a multilayer metal-leaf-clad laminate thus obtained and also the fray of the glass cloth can be prevented. By this method, the multilayer metal-clad laminate in which the occurrence of the creases of metal leaves of outermost layers is suppressed in molding of a multilayer board and, in addition, of which the performance and quality are not lowered can be realized.


Inventors:
MATSUO MASATO
SUZUKI YOSHIO
Application Number:
JP13244492A
Publication Date:
December 10, 1993
Filing Date:
May 25, 1992
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
B32B15/08; H05K1/05; H05K3/46; (IPC1-7): H05K3/46; B32B15/08; H05K1/05
Attorney, Agent or Firm:
Toshio Nishizawa



 
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