To provide a multilayer polyimide film in which the tensile strength and tensile elasticity are high, coefficient of linear expansion is in a definite range of low values, and surface properties are improved.
The multilayer polyimide film is constituted by laminating at least layer (a) and layer (b), wherein layer (a) is a silane modified polyimide layer which is obtained by drying and hardening a silane modified polyamide acid resin composition and layer (b) is a polyimide having a pyromellitic acid residue as at least an aromatic tetracarboxylic acid residue and a diamine residue having a benzoxazole structure as an aromatic diamine residue, and wherein the silane modified polyamide acid resin composition contains: a silane modified polyamide acid having an alkoxy group which is obtained by reacting a polyamide acid (1) with an alkoxy silane partial condensation product having an epoxy group (2) prepared by dealcoholization reaction of an epoxy compound having one hydroxy group per molecule (A) with an alkoxy silane partial condensation product (B); and a polar solvent.
YOSHIDA TAKESHI
OKUYAMA TETSUO
MAEDA SATOSHI
MATSUOKA TAKESHI
| JP2005112891A | 2005-04-28 | |||
| JP2002293933A | 2002-10-09 | |||
| JP2005064265A | 2005-03-10 |
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