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Title:
MULTILAYER PRINTED-COIL BOARD AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JPH0888122
Kind Code:
A
Abstract:

PURPOSE: To provide a multilayer printed-coil board capable of increasing piece extracting numbers from one board without externally exposing conductor part excluding the outer connecting terminal even if it is externally cut off.

CONSTITUTION: The multilayer printed-coil board is provided with a laminated layer body 3 comprising a plurality of laminated base materials 2, also a plurality of spiral patterns 4 comprising coils 6, a core containing hole 7 in the inner region of the coil 6 and a plurality of sectional plated through holes 10. The patterns 10 can be pulled out of specific positions of the spiral patterns 4 passing through the inside of the laminated body 3. At this time, respective pulled out patterns 4 are electrically connected to respective sectional plated through holes 10. Accordingly, in such a constitution, respective sectional plated through holes 10 can fill the roles of the outer connecting terminals.


Inventors:
DEMURA AKIHIRO
Application Number:
JP22067294A
Publication Date:
April 02, 1996
Filing Date:
September 14, 1994
Export Citation:
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Assignee:
IBIDEN CO LTD
International Classes:
H05K1/16; H01F17/00; H05K3/46; (IPC1-7): H01F17/00; H05K1/16; H05K3/46
Attorney, Agent or Firm:
Hironobu Onda