Title:
MULTILAYER PRINTED WIRING BOARD AND ITS MANUFACTURE
Document Type and Number:
Japanese Patent JPH06224555
Kind Code:
A
Abstract:
PURPOSE: To prevent microcracks from being generated due to low pressure by applying a pressure of less than a prescribed value to a laminated material, heating the material in a state where the pressure is applied, at least partially vulcanizing the material, and forming a laminated board. CONSTITUTION: This multilayer printed wiring board is obtained by laminating the alternate layers of the core material of ester cyanate and the prepreg material of the ester cyanate by pressing. For instance, in the case of vulcanizing the laminated board by adding the heat from the standard processing temperature of 180 deg.C, a vulcanizing pressure is less than 156 psi and is preferably 75 psi. Then, incomplete vulcanization is performed by lamination process, and post-calcination process is performed at the temperature of about 220 deg.C, without applying the pressure so as to complete the vulcanization.
Inventors:
GUREN TEII HADEITSUKU
Application Number:
JP30745593A
Publication Date:
August 12, 1994
Filing Date:
November 12, 1993
Export Citation:
Assignee:
HEWLETT PACKARD CO
International Classes:
B29C43/52; B32B27/00; B32B37/10; H05K1/03; H05K3/46; B29C43/20; B29K105/06; (IPC1-7): H05K3/46; B29C43/20; B29C43/52; B32B27/00
Attorney, Agent or Firm:
Endo Kyo
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