Title:
MULTILAYER PRINTED WIRING BOARD FOR SURFACE MOUNTING
Document Type and Number:
Japanese Patent JP2586361
Kind Code:
B2
Abstract:
PURPOSE: To elevate the reliability of a solder connection part by preventing the solder connection part of a composite type of multilayer printed wiring board surface mounted from cracking.
CONSTITUTION: In an object wherein the insulating layer a of an outer layer circuit is made glass woven fabric impregnated with epoxy resin and an insulating layer b, which constitutes an inner layer circuit board, and an adhesive layer between the inner layer circuit board and the insulating layer are made glass unwoven fabric impregnated with epoxy resin, a layer of butyral denatured phenol resin is made in contact with the outer layer circuit inside of this. This layer becomes the shape of rubber at high temperature, and it prevents the solder connection part from cracking caused by stress by absorbing said stress based on the difference of thermal expansion coefficient between the parts mounted on the surface and the insulating layer.
Inventors:
KANAI ATSUSHI
MITSUHASHI KAZUNORI
ITO SHIGERU
MITSUHASHI KAZUNORI
ITO SHIGERU
Application Number:
JP15429291A
Publication Date:
February 26, 1997
Filing Date:
June 26, 1991
Export Citation:
Assignee:
SHIN KOBE ELECTRIC MACHINERY
International Classes:
H05K3/46; H05K1/03; H05K3/38; (IPC1-7): H05K3/46; H05K1/03; H05K3/38
Domestic Patent References:
| JP5656851A | ||||
| JP2252294A |