PURPOSE: To obtain a multilayer printed wiring board of small warpage and torsion using a thick glass cloth without mis registration at a low cost by a method wherein the multilayer printed wiring board is composed of (n+1) sheets of prepregs impregnated with an increased amount of epoxy resin and n sheets of inner layer members.

CONSTITUTION: A guide hole 9 used at molding is provided, a specified circuit pattern 12 is formed through an etching or the like on a metal layer 11 formed on both sides of an insulating board 10, which is subjected to a surface treatment to serve as an inner layer member 13. A prepreg 14, formed of a thick glass cloth provided with the guide hole 9 and impregnated with a increased amount of epoxy resin, is overlapped, and a copper foil 15 is provided to an upper and a lower side respectively, which is thermally molded by a heat press 16 through a pin lamination method.