Title:
MULTILAYER SHEET FOR IC CARD
Document Type and Number:
Japanese Patent JP3960526
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a multilayer sheet which prevents the occurrence of a warp or a shrink of a formed IC card, which has excellent handleability at a manufacturing time without bringing about blocking and which can be suitably used for the IC card irrespective of a contact type or a non-contact type.
SOLUTION: The multilayer sheet for the IC card comprises a plastic resin layer, an adhesive resin layer and a mold release layer sequentially laminated by a co-extruding method. In this sheet, the resin layer is preferably made of a polyolefin or polyester hot-melt adhesive, and is porous. The mold release layer is preferably made of a polyolefin resin.
Inventors:
Haruhiko Mori
Application Number:
JP2002087516A
Publication Date:
August 15, 2007
Filing Date:
March 27, 2002
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
B32B27/32; B42D15/10; B32B7/06; B32B27/00; G06K19/077; (IPC1-7): B32B27/00; B42D15/10; G06K19/077
Domestic Patent References:
| JP2002086654A | ||||
| JP9123653A |
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