Title:
MULTILAYER SUBSTARTE AND MULTILAYER CIRCUIT BOARD USING THIS
Document Type and Number:
Japanese Patent JP2004327706
Kind Code:
A
Abstract:
To provide a multilayer substrate obtained by positioning and fixing a plurality of substrates with improved positional precision, and to provide a multilayer wiring board.
The substrates form a circuit, and an insulating resin component is arranged around a part or the whole of the circuit. The multilayer substrate obtained by positioning and fixing the plurality of substrates in the thickness direction of the substrates by using a heat source is provided, and the multilayer wiring board using this is provided.
Inventors:
NAKAMURA HIDEHIRO
Application Number:
JP2003120132A
Publication Date:
November 18, 2004
Filing Date:
April 24, 2003
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
H05K3/46; (IPC1-7): H05K3/46
Domestic Patent References:
| JP2002232139A | 2002-08-16 | |||
| JPH0243797A | 1990-02-14 | |||
| JPH03276795A | 1991-12-06 | |||
| JP2003017856A | 2003-01-17 |
Attorney, Agent or Firm:
Hidekazu Miyoshi
Iwa Saki Kokuni
Akira Kurihara
Kawamata Sumio
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu
Iwa Saki Kokuni
Akira Kurihara
Kawamata Sumio
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu
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