PURPOSE: To facilitate the manufacture of a multilayered wiring board, and improve the level of integration of a wiring board.

CONSTITUTION: A wiring pattern 14 and a land 16 are formed on the surfaces of a board 10 having electric insulating properties. A plurality of the boards wherein conductor 20 is buried in the thickness direction at the forming portions or the lands, and the wiring patterns 14 are connected with the lands 16 are laminated in an unified body by using anisotropic conductive agent 12. The land 16 and the wiring patterns 14 or the land 16 which are in facing positions of neighboring boards are electrically connected.