To provide a multilayered wiring board which is profitably manufactured at a lower cost through a simple manufacturing process by eliminating a process of filling through-holes with resin and carrying out a flattening operation and has the high reliability and durability of interlayer conductive connections, and to provide its manufacturing method.
The multilayered wiring board is equipped with a first insulating layer 11 provided with a through-hole 12, a first plating layer 13 formed on the inner wall of the through-hole 12 and around its opening, a columnar metal body 16 extending upright from around the opening, a second metal plating layer 19 which is electrically connected to the columnar metal body 16 and formed above the opening of the through-hole 12, and a second insulating layer 18 which is interposed between the second plating layer 19 and the first plating layer 13 as filling through-hole 12.
HOJO NORIYUKI
YOSHIMURA EIJI
DAIWA KOGYO CO
Koichi Kajisaki
Yuzo Ozaki
Toshihiko Taniguchi
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