MULTIPHASE THERMOPLASTIC COMPOSITION BASED ON POLYAMIDE RESIN CONTAINING ETHYLENE POLYMER HAVING EPOXIDE GROUP

Japanese Patent JP2769090

B2

PURPOSE: To obtain a multiphase thermoplastic composition having a high impact resistance at a low temperature, which is based on a polyamide resin containing an ethylene polymer having an epoxide group.
CONSTITUTION: A multiphase thermoplastic composition is based on a polyamide resin comprising 50 to 95 wt.% at least one polyamide resin (A) and 5 to 50 wt.% the following component (B). The component (B) comprises (a) 5 to 100 wt.% at least one ethylene/alkyl (meth)acrylate/unsaturated epoxide terpolymer (I) and from 0 to 95 wt.% at least one polymer chosen from the group consisting of (1) polyethylene, (2) an ethylene/alkyl (meth)acrylate copolymer (II) and (3) an ethylene/alkyl (meth)acrylate/unsaturated dicarboxylic acid anhydride terpolymer (III).

JPH086005	INDUSTRIAL APPLICABILITY [Title of Invention] Acrylic resin composition for molded article having excellent matt property, molded article, and method for producing the same
JP5380022	Organic-inorganic composite composition
JP3889345	FLEXIBLE ACRYLIC RESIN COMPOSITION

Marius Ale
Patrice Pere

JP9850493A

June 25, 1998

April 01, 1993

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Elf Atochem Society Anonymous

C08L33/04; C08L33/08; C08L35/00; C08L23/04; C08L63/00; C08L77/00; C08L77/02; C08L77/06; C08L23/08; (IPC1-7): C08L77/00; C08L23/04; C08L33/08; C08L63/00

JP63235365A
JP63199755A
JP63146928A
JP63128070A
JP5239363A
JP4275371A
JP4817665B1

Keiko Okabe (1 person outside)

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