Title:
MULTIPLE WIRING BOARD
Document Type and Number:
Japanese Patent JP3842683
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a multiple wiring board in which a ceramic base board can be divided accurately and easily along division grooves.
SOLUTION: A large number of wiring board regions 2 each having a part 1a for mounting an electronic component on the upper surface thereof, metallization conductors 5 being led out to the outer circumferential corner parts and metallization pads 6 for external connection fixed to the outer circumferential corner parts on the lower surface thereof are formed in the center of a ceramic base board 1 while being sectioned by division grooves 3, and a through hole 4 having inner wall applied with a side face metallization conductor 7 is made above the intersection of the division grooves 3. In such a multiple wiring board, the ceramic base board 1 is provided, on the lower surface thereof on the periphery of the through hole 4, with an annular land pattern 8 connected with the side face metallization conductor 7 and the metallization pads 6 for external connection while surrounding the through hole 4 and the metallization pad 6 for external connection is spaced apart from the division groove 3 except the land pattern 8.
Inventors:
Miyanohara Wataru
Application Number:
JP2002086546A
Publication Date:
November 08, 2006
Filing Date:
March 26, 2002
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
H05K1/02; H05K1/11; H01L23/13; H05K3/00; (IPC1-7): H05K1/02; H01L23/13; H05K1/11; H05K3/00
Domestic Patent References:
| JP200168799A | ||||
| JP2001308469A | ||||
| JP200168823A | ||||
| JP2000294899A |