Title:
【発明の名称】半導体装置の製造方法
Document Type and Number:
Japanese Patent JP3070532
Kind Code:
B2
Inventors:
Naoki Sakura
Application Number:
JP18008897A
Publication Date:
July 31, 2000
Filing Date:
July 04, 1997
Export Citation:
Assignee:
NEC
International Classes:
H01L29/872; H01L21/338; H01L29/47; H01L29/812; (IPC1-7): H01L21/338; H01L29/812; H01L29/872
Domestic Patent References:
| JP8203926A | ||||
| JP2214126A |
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)