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Patent Searching and Data


Title:
MANUFACTURE OF PRINTED CIRCUIT BOARD
Document Type and Number:
Japanese Patent JPH0541573
Kind Code:
A
Abstract:

PURPOSE: To provide a method for manufacturing a printed circuit board, in which a resistor forming Ni-Cr alloy layer can be accurately etched in the method for manufacturing the board containing a resistor.

CONSTITUTION: A method for manufacturing a printed circuit board containing a resistor by connecting a copper foil 11 of a predetermined pattern to a resistance layer 12 made of a metal layer having a predetermined pattern and bonding it to a base material 13 comprises the steps of forming the layer 12 made of the metal layer having the predetermined pattern on the foil 11, and adhering the foil 11 having the layer 12 of the predetermined pattern to the material 13 through an adhesive layer 22. The method further comprises the steps of forming a resist pattern 14 for etching on the foil 11, and selectively etching only the foil 11 in a predetermined pattern by using etchant for selectively etching only the foil 11 without etching the layer 12 with the pattern 14 as a mask.


Inventors:
HORIGUCHI NAOKO
Application Number:
JP19649991A
Publication Date:
February 19, 1993
Filing Date:
August 06, 1991
Export Citation:
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Assignee:
FUJITSU LTD
International Classes:
H05K1/16; H05K3/06; (IPC1-7): H05K1/16; H05K3/06
Attorney, Agent or Firm:
Teiichi