Title:
SOLDER RESIST INK RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH0741716
Kind Code:
A
Abstract:
PURPOSE: To obtain a solder resist ink resin compsn. which has a long pot life and an excellent workability and gives a cured film excellent in resistance to soldering heat, adhesion to a printed circuit board, and chemical resistance.
CONSTITUTION: This ink resin compsn. contains a photopolymerizable unsatd. polycarboxylic acid resin (obtd. by reacting a novolak epoxy resin. an unsatd. monocarboxylic acid, and an org. polybasic acid anhydride), a photopolymn. initiator, tris(2,3-epoxypropyl) isocyanurate, and melamine cyanurate.
Inventors:
IKEDA HISAO
SHIRAKAWA MASAYOSHI
SHIRAKAWA MASAYOSHI
Application Number:
JP18634593A
Publication Date:
February 10, 1995
Filing Date:
July 28, 1993
Export Citation:
Assignee:
NISSAN CHEMICAL IND LTD
International Classes:
C08G59/40; C09D11/00; C09D163/00; C09D163/10; G03F7/027; H05K3/28; (IPC1-7): C09D11/00; C08G59/40; C09D163/00; C09D163/10; G03F7/027; H05K3/28
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