Title:
DEVICE FOR SOLDERING AXIAL ELECTRONIC PARTS
Document Type and Number:
Japanese Patent JP2528776
Kind Code:
B2
Abstract:
PURPOSE: To enable soldering leads in an axial electronic parts to terminal group by shifting a coil receiving jig together with a chuck downward so as to apply the solder to the abutting part from a solder vessel.
CONSTITUTION: In a soldering device, the solder vessel 40, an electronic parts handling device 5, and a coil handling device fitting the coil receiving jig 46 fitted with a flyback transformer secondary coil 1 are arranged. On the terminals in the flyback transformer secondary coil 1, the lead tip parts in the axial electronic parts carried while being held with the chuck 9a are abutted and also while keeping the abutting condition, the coil receiving jig 46 is shifted downward together with the chuck 9a to apply the solder to the abutting part from the solder vessel 40. By this method, the soldering of the axial electronic parts can automatically be applied.
Inventors:
Kanbara, Kenji
Fukumoto, Shinsuke
Fukumoto, Shinsuke
Application Number:
JP30809292A
Publication Date:
August 28, 1996
Filing Date:
October 21, 1992
Export Citation:
Assignee:
TORAY ENG CO LTD
International Classes:
B23K1/08; B23K1/00; H01R43/02; (IPC1-7): B23K1/08; B23K1/00; H01R43/02