Title:
SEMICONDUCTOR PRESSURE SENSOR
Document Type and Number:
Japanese Patent JP3042344
Kind Code:
B2
Abstract:
PURPOSE: To minaturize a semiconductor pressure sensor.
CONSTITUTION: In a semiconductor pressure sensor with a semiconductor pressure sensor chip 1, a pedestal 2, a recessed part 3a housing the semiconductor pressure sensor chip 1 and the pedestal 2 inside, a package body 3 where a pressure introduction port 3b is formed, and a lead 13 which is extracted to the outside of the package body 3 which is electrically connected to the semiconductor pressure sensor by wire bonding, a lead is extracted toward the side of the package body 3 and bent almost along the side and bottom surfaces of the package body. A lead 13 does not greatly protrude toward the side from the package body 13, thus miniaturizing the semiconductor pressure sensor.
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Inventors:
Hiroshi Saito
Tomohiro Inoue
Mitsuhiro Kani
Tomohiro Inoue
Mitsuhiro Kani
Application Number:
JP1120195A
Publication Date:
May 15, 2000
Filing Date:
January 27, 1995
Export Citation:
Assignee:
MATSUSHITA ELECTRIC WORKS,LTD.
International Classes:
G01L9/04; G01L9/00; (IPC1-7): G01L9/04
Domestic Patent References:
| JP4218739A | ||||
| JP738122A | ||||
| JP4312980A | ||||
| JP4113045U | ||||
| JP564748U | ||||
| JP6438545U | ||||
| JP63105332U | ||||
| JP3125219U | ||||
| JP1165436U |
Attorney, Agent or Firm:
Junji Ando (1 person outside)