Title:
MANUFACTURE OF SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPH0629258
Kind Code:
A
Abstract:
PURPOSE: To prevent a cover film of a mask part from being etched to lowering its protection capability by the use of bubbles of a photoresist film resulting from voids generated in a cover film provided on minute gaps of wirings.
CONSTITUTION: A polyimide precursor film having high viscosity is coated on the surface of a cover film 6 to cover void 7. Next, an aperture is formed on the polyimide precursor film and a polyimide film 10 is formed by heat treatment. Thereafter, an aperture is then formed on the cover film 6 within the aperture of the polyimide precursor film.
Inventors:
NISHIMOTO SHOZO
Application Number:
JP18200592A
Publication Date:
February 04, 1994
Filing Date:
July 09, 1992
Export Citation:
Assignee:
NEC CORP
International Classes:
H01L21/302; H01L21/3065; (IPC1-7): H01L21/302
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)
Next Patent: 画像読取装置