PURPOSE: To provide a connecting structure for hybrid integrated circuit having excellent characteristics in which problems of the generation of a short circuit between adjacent terminals by the dislocation of a conventional lead frame and a reduction in mounting density by the soldering area of the cramp part of the lead frame can be solved, a soldering bridge is difficult to form even if the connecting lead space is narrowed, the smaller area is sufficient for the connecting part, and the mounting density can be improved, in a connecting device used in a substrate for hybrid integrated circuit and a hybrid integrated circuit into which this substrate is integrated.

CONSTITUTION: A plurality of external connecting notch parts 2 are provided on a hybrid integrated circuit substrate 1, the inner walls of the notch parts and external connecting pats 5', 5" on both sides of the base are formed from printed conductors, and the substrate is fitted to and held by a connecting device 3 having a plurality of connecting leads 4 integrally molded thereon in conformation to the plurality of external connecting notch parts 2. The notch parts 2 are soldered to the connecting leads. Thus, positional precision is ensured, connecting pitch can be narrowed, and the mounting density can be improved with less soldering area.