PURPOSE: To obtain the subject new resin useful as a resin component for sealing a semiconductor device, providing a cured material having extremely low water absorption and low elasticity by adding a specific organosilicon compound to an alkenyl group of an aralkyl resin containing an alkenyl group.
CONSTITUTION: Three Si groups of an organosilicon compound of formula I (R1 is monofunctional hydrocarbon, OH, etc.; (a) and (b) are integers satisfying 0.01≤a≤1, 1≤b≤3, 1≤a+b≤4) are added to an alkenyl group of an aralkyl resin containing an alkenyl group to give the objective resin. The resin is preferably obtained by adding the compound of formula I to the aralkyl resin containing an alkenyl group in the presence of a platinum catalyst such as chloroplatinic acid in an inert organic solvent such as benzene at 60-120°C for 30 minutes to 10 hours. A resin of formula II (R is H, Cl, etc.; G is OH, glycidyl ether, etc.; (n) is 0-20) etc., is preferable as the aralkyl resin containing an alkenyl group.
NARUMI MANABU
SHIMIZU HISASHI
| JPS6356515A | 1988-03-11 | |||
| JPH02180952A | 1990-07-13 | |||
| JPS62212417A | 1987-09-18 | |||
| JPS6221417A | 1987-01-29 | |||
| JPH05331354A | 1993-12-14 | |||
| JPH0473795A | 1992-03-09 | |||
| JPH0559175A | 1993-03-09 | |||
| JPH0597949A | 1993-04-20 |