Title:
【発明の名称】集積回路用パッケージ
Document Type and Number:
Japanese Patent JP3009788
Kind Code:
B2
Abstract:
A ceramic base of an IC package has a laminated structure and has two conductive layers sandwiched between insulating ceramic layers. One of the conductive layers is used as a power source layer and electrically connects a plurality of power source terminals of an IC chip to a single power source lead. The other conductive layer is used as an earth layer and electrically connects a plurality of earth terminals of the IC chip to a single earth lead.
Inventors:
Naomika Kato
Kazuyuki Maruyama
Kazuyuki Maruyama
Application Number:
JP25896292A
Publication Date:
February 14, 2000
Filing Date:
September 01, 1992
Export Citation:
Assignee:
Nippon Special Ceramics Co., Ltd.
International Classes:
H01L23/04; H01L23/10; H01L23/12; H01L23/08; H01L23/15; H01L23/24; H01L23/498; H01L23/50; (IPC1-7): H01L23/50; H01L23/12
Domestic Patent References:
| JP58110066A | ||||
| JP4340257A |
Attorney, Agent or Firm:
Masayuki Yano