PURPOSE: To obtain the subject composition, having sufficient stability at ambient temperature and moderate tack and drapeability, curable at a relatively low temperature and useful as aircraft, etc., by using an epoxy resin, a bisphenolic compound and specific plural curing agents in combination.

CONSTITUTION: This resin composition is composed of (A) 100 pts.wt. epoxy resin, (B) 5-100 pts.wt. bisphenolic compound or a reactional product of the bisphenolic compound with a monoglycidyl ether of the bisphenolic compound, (C) a urea-based epoxy resin curing agent, e.g. a compound expressed by the formula (X1 and X2 are H, CH3, Cl or Br) and (D) a heat-curing and microcapsular type latent curing agent capable of initiating the reaction at about 80°C. Furthermore, the component (A) is preferably a mixture of a liquid bisphenolic type epoxy resin having 170-200 epoxy equiv. with a solid bisphenolic type epoxy resin having 400-4000 epoxy equiv.