PURPOSE: To provide a thin type circuit board having good heat radiation characteristics and its manufacture at a low cost with respect to a circuit board and its manufacture for mounting a circuit elements containing semiconductor elements such as IC's.

CONSTITUTION: A circuit board is produced by a process for forming a metal foil on the surface of a resin board 1; a process for forming a pattern of the heat radiating region of a circuit element 2 and a circuit pattern 4 by a metal foil on the metal foil; a process of irradiating laser light to the surface at the opposite side of the pattern in the radiating region of the resin board 1, of removing part of the resin board 1 of the heat radiating region, of forming a hole for housing the circuit element 2 and of exposing the metal foil in the heat radiating region; and a process for inserting the circuit element into the hole and for adhering the circuit element 2 to the exposed metal foil in the heat radiating region.