Title:
【発明の名称】リードフレーム
Document Type and Number:
Japanese Patent JP2580740
Kind Code:
B2
More Like This:
JPH0661377 | SEMICONDUCTOR INTEGRATED DEVICE |
JPH06177191 | RESIN MOLDING APPARATUS |
WO/1996/027900 | METHOD OF PRODUCTION OF SEMICONDUCTOR DEVICE AND SEALING PELLET USED FOR THE METHOD |
Inventors:
SHIBUYA KOJIRO
Application Number:
JP25867288A
Publication Date:
February 12, 1997
Filing Date:
October 13, 1988
Export Citation:
Assignee:
NIPPON ELECTRIC CO
International Classes:
H01L21/56; H01L23/28; H01L23/50; (IPC1-7): H01L21/56; H01L23/28; H01L23/50
Domestic Patent References:
JPS58127356A |
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)