Title:
【発明の名称】高密度回路配線基板、その製造方法及び高密度回路配線基板を用いたマルチチップモジュール
Document Type and Number:
Japanese Patent JP3059658
Kind Code:
B2
Inventors:
Yoshiro Aiba
Yoshio Nakamura
Yoshio Nakamura
Application Number:
JP4550695A
Publication Date:
July 04, 2000
Filing Date:
March 06, 1995
Export Citation:
Assignee:
Toshiba Ceramics Co., Ltd.
International Classes:
C04B35/14; H01L23/522; H01L23/538; H05K1/03; (IPC1-7): H05K1/03; C04B35/14
Domestic Patent References:
| JP62241391A | ||||
| JP5927120B2 |
Attorney, Agent or Firm:
Saichi Suyama