PURPOSE: To provide manufacturing method for a multilayer ceramics circuit substrate of low conductor resistance value by improving density of the conductor after sintering, relating to the manufacturing method of the multilayer ceramics circuit substrate used for such electronic equipments as a computer and the multilayer ceramics circuit substrate manufactured with the method.

CONSTITUTION: A via hole is opened on a ceramics green sheet, and it is filled with a conductor paste, and on the green sheet filled with the conductor paste, the conductor paste is printed for a conductor pattern to be forced, and green sheets on which the conductor pattern is formed are laminated together for sintering, thus a multi-layer ceramics circuit substrate is manufactured. In this manufacturing method, with sintering process continued, thermal treatment is done at the temperature lower than the sintering.