Title:
SEMICONDUCTOR DEVICE AND INSPECTION METHOD THEREOF
Document Type and Number:
Japanese Patent JPH0645420
Kind Code:
A
Abstract:
PURPOSE: To provide the construction of a semiconductor device for judging the quality of the semiconductor device upon positioning a die bond, and provide an inspection method of the semiconductor device.
CONSTITUTION: There are provided a wiring 5 extending along the outer periphery of a semiconductor device 2 in a wafer process and an electrode 6 serving as input and output terminals of the wiring 5. Further, there is performed, upon positioning of a die bond, probing of an internal circuit of the semiconductor device 2 and the electrode 6 connected with the wiring 5 provided on the outer periphery of the semiconductor device.
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Inventors:
NAKAMURA AKIO
Application Number:
JP19831892A
Publication Date:
February 18, 1994
Filing Date:
July 24, 1992
Export Citation:
Assignee:
OKI ELECTRIC IND CO LTD
International Classes:
H01L21/60; H01L21/66; (IPC1-7): H01L21/66; H01L21/60
Attorney, Agent or Firm:
Toshiaki Suzuki
Next Patent: THRESHING DEPTH-CONTROLLING APPARATUS