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Title:
焼結ダイアタッチ及び類似した用途のためのナノ銅ペースト及びフィルム
Document Type and Number:
Japanese Patent JP7110410
Kind Code:
B2
Abstract:
A sintering powder comprising copper particles, wherein: the particles are at least partially coated with a capping agent, and the particles exhibit a D10 of greater than or equal to 100 nm and a D90 of less than or equal to 2000 nm.

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Inventors:
Gosal, Shamic
Chandran, Renmya
Monoharan, Benodo
Sarkar, Suiri
Shin, Bawa
Rohto, Rahul
Application Number:
JP2020572393A
Publication Date:
August 01, 2022
Filing Date:
June 21, 2019
Export Citation:
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Assignee:
ALPHA ASSEMBLY SOLUTIONS INC.
International Classes:
B22F1/052; B22F1/102; B22F7/08; B22F9/00; B22F9/24; H01B1/00; H01B1/22; H01B5/00
Domestic Patent References:
JP2010018832A
Foreign References:
WO2012157704A1
US20060090597
Attorney, Agent or Firm:
Yamato Kento
Haruhiko Ema



 
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