To form isotropic nickel plating on a substrate by allowing a metallic conductor to adhere to a nickel ferritic substrate and executing electroplating in a nickel plating bath composed of nickel salt and a specified acidic buffer.
A metallic conductor is allowed to adhere to the surface of a nickel ferritic substrate 20, which is put in a nickel plating bath composed of nickel salt and an acidic buffer contg. no boric acid regulating the value of pH in the plating bath to ≤3, and electroplating is executed to form a nickel layer with a desired thickness. At this time, as the nickel ferritic substrate 20, Ni1-xZnxFe2O4 (0<x<1) or the like is used, as the metallic conductor, copper or the like is used, as the nickel salt, nickel sulfate or the like is used, and as the acidic buffer, citric acid or the like is used. In this way, the isotropic nickel layer with a desired thickness can be formed on the substrate 20, and a highly integrated circuit can be produced.
TEESAN UU
RIN FURANSHISU MEIYAA
| JPH0760769B2 | 1995-06-28 | |||
| JPH0222160B2 | 1990-05-17 | |||
| JPS4827183B1 | 1973-08-20 | |||
| JPS619392B2 | 1986-03-22 | |||
| JPH03161910A | 1991-07-11 | |||
| JPH0677022A | 1994-03-18 |