To provide a non-contact IC tag which can stably be used even under a high temperature environment.
This non-contact IC tag 10 is configured by storing an inlet 1 formed by arranging at least an IC chip and an antenna on a film-shaped base material in a main body block 12. The main body block 12 has a recessed part 13 formed on the back face, and the inlet 1 is stored in the recessed part 13, and the back part of the inlet 1 is closed by an embedded block 14 shaped corresponding to the recessed part 13. The internal air of the non-contact IC tag 10 is excluded by pushing the embedded block 14 from the back part of the inlet 1 into the recessed part 13 to close the back part of the inlet 1. Therefore, it is possible to suppress internal residual air more efficiently than a conventional manner. Also, even when a little residual air may be expanded under high temperature, any structurally weak portion which used to exist in a conventional manner can be eliminated, and any problem such as damage can be prevented from being generated.
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MIKI YASUTOSHI
TAMURA HISAYOSHI
YOSHIDA TETSUYA
YOSHIKAWA HIDEO
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