Title:
NONNCYANOGEN TYPE SILVER PLATING SOLUTION
Document Type and Number:
Japanese Patent JPS54155132
Kind Code:
A
Abstract:
PURPOSE:To obtain smooth tough plating with low toxicity and improved finishing properties by adding a restricted amt. of triethanolamine as a film reformer to the title plating soln. contg. a specified amt. of SCN<-> and Ag<+>. CONSTITUTION:To a silver plating soln. contg. 0.3-10, pref. 2-5 mol/l of SCN<-> and 0.04-0.8 mol/l of Ag<+> is added 5X(10<-3>-10<-1>) mol/l of thriethanolamine as a film reformer. Since this soln. is applicable to high speed electrodeposition at a bath temp. of 35-75 deg.C, thick plating of about 15-30 mum is easily carried out in this soln. to form movable contact point parts of electric power equipment. About 100% current efficiency is attained, and Ag plating speed in this soln. is equal to or higher than that in a CN bath of the same temp.
Inventors:
SUZUKI YOSHIHIRO
URA MITSURU
TAKAHASHI HIROSHI
URA MITSURU
TAKAHASHI HIROSHI
Application Number:
JP6328078A
Publication Date:
December 06, 1979
Filing Date:
May 29, 1978
Export Citation:
Assignee:
HITACHI LTD
International Classes:
C25D3/46; (IPC1-7): C25D3/46