Title:
NONWOVEN ADHESIVE MATERIAL
Document Type and Number:
Japanese Patent JPS5493027
Kind Code:
A
Abstract:
PURPOSE: The title material suitable for thermal adhesion having improved bonding strength, processing characteristics, light- and chemical resistance, comprising more than a given amount of a specific saponificated ethylene-vinyl acetate copolymer.
CONSTITUTION: A) Not less than 20 wt.% of ethylene-vinyl acetate having 10W45 mole %, preferably 25W40 mole % of a saponificated hydroxyl group is blended with B a nonwoven forming material, e.g., polyethylene terephthalate.
Inventors:
IKEDA KIYOSHI
Application Number:
JP16001477A
Publication Date:
July 23, 1979
Filing Date:
December 29, 1977
Export Citation:
Assignee:
TEIJIN LTD
International Classes:
C09J7/00; (IPC1-7): C09J7/00