Title:
NOVEL EPOXY RESIN AND EPOXY RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2789325
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition which can give cured products having excellent heat resistance and mechanical strengths without detriment to the toughness and having excellent dimensional stability, humidity resistance and noncorrosiveness to metals by selecting an epoxy resin having a structure represented by a specified formula.
SOLUTION: This resin is represented by formula I [wherein R1 to R4 are each H, a 1-5C alkyl or an alkenyl; A is a structure having a selectivity of p-phenylene groups of 80% or below and represented by formula II (wherein R5 and R6 are each H or a 1-3C alkyl); and (l), (m) and (n) are each an integer of 0 or greater]. It sometimes happens that conventional cured epoxy resin products lack in toughness, heat resistance, humidity resistance, dimensional stability, etc. For example, when they are used as sealing agents for electronic components, the sealing materials are sometimes cracked. The above epoxy resin is prepared by introducing a suitably fixable bisphenol skeleton into an epoxy resin having a biphenyl skeleton, and therefore it can give cured products improved in toughness without detriment to the heat resistance and excellent in humidity resistance, dimensional stability, mechanical strengths, low corrosiveness to aluminum, etc.
Inventors:
YAMAMOTO HISANAO
Application Number:
JP6027296A
Publication Date:
August 20, 1998
Filing Date:
February 23, 1996
Export Citation:
Assignee:
ASAHI CHIBA KK
International Classes:
C08K3/00; C08G59/06; C08G59/24; C08L63/00; (IPC1-7): C08G59/06; C08G59/24; C08K3/00; C08L63/00
Domestic Patent References:
| JP6147725A | ||||
| JP314816A | ||||
| JP977846A | ||||
| JP977847A |
Attorney, Agent or Firm:
Minoru Ito (1 person outside)