Title:
ノズル構成および供給チャネル
Document Type and Number:
Japanese Patent JP6970304
Kind Code:
B2
Abstract:
Examples include a fluid ejection device. The fluid ejection device includes a fluid ejection die with a die length and a die width, the fluid ejection die being coupled with a support structure having a fluid supply channel therethrough. The fluid ejection die includes a plurality of nozzles arranged in columns at die length positions along the die length and die width positions along the die width such that only one nozzle is positioned at each die length position. A fluid ejection chamber is coupled with each respective nozzle of the plurality of nozzles, and fluid feed hole fluidically coupled with the fluid supply channel and each respective ejection chamber.
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Inventors:
Cook, Garen
Clark, Garrett, Yee
Cambie, Michael, W
Prisilla, James, Earl
Shiver, Richard
Delhi Berry, Frank, Dee
Choi, Si-Lan, Jay
Clark, Garrett, Yee
Cambie, Michael, W
Prisilla, James, Earl
Shiver, Richard
Delhi Berry, Frank, Dee
Choi, Si-Lan, Jay
Application Number:
JP2020537523A
Publication Date:
November 24, 2021
Filing Date:
March 12, 2018
Export Citation:
Assignee:
Hewlett-Packard Development Company
Hewlett-Packard Development Company, L.P.
Hewlett-Packard Development Company, L.P.
International Classes:
B41J2/14; B41J2/155; B41J2/18
Domestic Patent References:
| JP2014510649A | ||||
| JP2017124617A |
Foreign References:
| US20140327713 |
Attorney, Agent or Firm:
Satoshi Furuya
Akihiro Onishi
Rei Hosoi
Akihiro Onishi
Rei Hosoi
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